Aiden Vigue

Résumé

Hardware & software engineer pursuing a B.S. in Computer Science at Purdue, graduating 2027. I design multi-layer PCBs, write firmware, and build the full-stack systems that connect embedded devices to the cloud.
Experience
Jan 2024 — Present

Hardware & Software Engineer

Terranova
  • Designed and engineered a hardened industrial PLC system: 6 custom 4-layer PCBs with plug-and-play module architecture, CAN bus auto-discovery and provisioning via a custom bootloader with protobuf serialization, sub-10ms response times, and wireless sub-networks with 10-mile range.
  • Develop FreeRTOS firmware in C across STM32 and ESP32 platforms with LTE Cat-M1 connectivity, analog sensor integration, and Bluetooth coprocessor firmware enabling iOS app control.
  • Built a custom Yocto Linux distribution for the SoM to orchestrate the full network of connected boards; containerized NestJS backend with embedded Postgres and time-series DB, fronted by a Vue app with a custom component library.
  • Coordinate global fabrication runs and own full hardware lifecycle: schematic capture, BOM management, register-level bring-up and debug with logic analyzers and oscilloscopes.
Nov 2023 — Present

Founder

Koios Digital
  • Consulting and consumer hardware product development focused on RF and cloud control.
  • Building an IoT as-a-service platform with managed PKI, device observability, and secure provisioning for constrained devices.
Notable Projects
Dec 2025 — Present

132-Module Split Flap Display

  • 132 custom 20×20mm 4-layer STM32F103 PCBs with discrete MOSFET H-bridge, IR beam-break homing, and CAN transceiver; DMA-driven I/O with an optimized superloop scheduler for low-latency command acknowledgement and preventative watchdogs.
  • Designed entire mechanical system from scratch: 3D-printed module housings with tight tolerances, UV-printed flaps on FR4 fiberglass, waterjet-cut metal enclosure, and custom crimped wiring harnesses.
  • Distributed power architecture: PCB-mount AC-DC converters (30–48W per backplane) with 10–15mm AC/signal isolation and proper creepage for 120VAC.
  • NestJS/TypeScript backend with Redis and Postgres enabling sub-50ms cross-display synchronization and worldwide control via mTLS-secured WebSocket.
Mar 2024 — Jan 2026

Cloud-Connected LED Matrix System

  • Engineered a custom ESP32-S3 HUB75 controller through 10+ schematic revisions: dual 74HC245 level shifters, HUSB238 USB-C PD negotiation up to 20V, MP8759GD buck converter, supporting multiple panel sizes with a 10-pin expansion header for multi-panel chaining.
  • Built full-stack real-time pipeline from scratch: Go WebSocket server delivering sub-frame-latency updates, Go rendering sidecar with cached frame delivery, NestJS API, Redis Streams for device-to-cloud messaging, Capacitor Vue mobile app, mTLS certificate-based device identity, and globally distributed Postgres cluster management.
  • Manufactured and validated 25+ test devices end-to-end: BOM sourcing across 50+ unique components, SMT stencil reflow, USB-C PD power validation, and RF compliance testing through 10+ iterative board spins.
Nov 2022 — May 2025

Autonomous Kinetic Sand Art Table

  • Custom 4-layer ESP32-S3 PCB with STUSB4500 USB-C PD negotiation, dual TMC2209 stepper drivers with SPI control, eMMC storage with impedance-matched high-speed trace routing, and a 95% efficiency buck converter holding temperature rise under 10°C with careful power plane layout for high-current traces.
  • Designed custom polar mechanism optimized for low-cost 3D printing; wrote a polar-based lookahead/lookback motion planner with smooth acceleration blending across changing Cartesian directions.
  • Custom Vue app with real-time pattern preview, remote control over mTLS, and a community pattern store with 1,000+ downloadable patterns.
Education
Expected 2027

BSc Computer Science / Certificate in Entrepreneurship

Purdue UniversityWest Lafayette, IN
Skills
Languages
  • C
  • C++
  • TypeScript
  • Python
  • Swift
  • Go
Technologies
  • FreeRTOS
  • ESP-IDF
  • Docker
  • Vue / Nuxt
  • NestJS
  • Postgres
  • Redis
  • Embedded Linux
Software
  • Altium Designer
  • Fusion 360
  • CMake
  • Git
Hardware
  • STM32
  • ESP32
  • CAN Bus
  • LTE Cat-M1
  • BLE
  • USB-C PD
  • HUB75
Extracurriculars

Eagle Scout

Achieved 2022
Boy Scouts of America
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